The main construction of the Qingtongjian third-generation semiconductor industrial base has recently started.

The industrial base, located at the intersection of Danzi Boulevard and Guangke Road 3 in Pingshan District, is one of Shenzhen’s key projects for 2021 and a critical part of Shenzhen’s plan to accelerate the development of the third-generation semiconductor industry.

With an investment of 350 million yuan, the industrial base will have a laboratory for the research and development of silicon carbide (SiC) power devices and production lines for automotive SiC power module packaging. The facilities will be put into service in April 2023 with an expected annual production volume of 2 million SiC devices.

In addition, a third-generation semiconductor research and development center and an incubator of the Shenzhen China-Europe Innovation Center will also be constructed at the industrial base.

Home to multiple key enterprises of the semiconductor industry, such as SMIC, Shenzhen TIGO Semiconductor Co, Ltd., and BASiC Semiconductor, Pingshan is considered to be an important center for the development of the third-generation semiconductor industry.