A scene at the WESEMiBAY Semiconductor Ecosystem Expo 2026.

The WESEMiBAY Semiconductor Ecosystem Expo 2026 opened Oct. 14 at the Shenzhen Convention and Exhibition Center. Spanning more than 70,000 square meters, the expo features four themed zones: wafer manufacturing, compound semiconductors, integrated circuit (IC) design and advanced packaging. It has brought together more than 1,000 companies, research institutions and investors.

Pingshan District organized local semiconductor and IC companies to take part, including Capchem, Fitok, Manst, Maxair, Mige Lab, G&D Systems, and Miraclean, highlighting the district’s industrial capabilities.

The exhibitors cover key segments of the industrial chain, including semiconductor-grade electronic chemicals, high-purity fluid-control systems, high-end coating equipment, precision pneumatic components, wafer heat-treatment equipment, precision-cleaning consumables and process R&D platforms. Together, they represent a broad range of capabilities spanning materials, components, equipment and process development. At the expo, the companies are showcasing new products, holding business meetings and taking part in industry-academia exchanges.

The G&D Systems booth.

Pingshan is the city’s core base for silicon-based semiconductor manufacturing and a key part of Shenzhen’s drive to become a leading hub for China’s IC industry. The district is home to more than 200 high-quality enterprises, anchored by SMIC Shenzhen and Pensun. They include six listed companies, 13 national-level specialized and innovative “little giant” enterprises, and 44 specialized and innovative small and medium-sized enterprises.

Pingshan accounts for more than 60% of Shenzhen’s IC chip manufacturing capacity. Its industry is supported by multiple provincial- and municipal-level innovation platforms and public technology platforms, and has developed a complete ecosystem spanning design, manufacturing, packaging, testing and applications.

Looking ahead, Pingshan will focus on emerging fields such as advanced packaging, high-bandwidth memory (HBM), computing chips and optical communications, while strengthening its capabilities in semiconductor materials and core equipment components.

The district will continue to use its “leading companies + industrial spaces + public platforms + funds” model to support businesses across the supply chain, deepen the integration of industry, innovation and capital, and develop a nationally competitive IC industry hub.